YCS-H03 MAX Universal Motherboard Chip Ring Fixture for Mobile Phone Soldering Repair
₱1500.00₱850.00
Out of stock
Features:
Larger size, more clamping space, fully applicable to various types of chips/motherboards
Removal of tin and glue, no need to adjust the direction, travel coaxial movement
For iPhone / Android full series IC chip, removal of glue/tin Not blocking the knife
Motherboard cleaning doesn't require adjusting the orientation, clean up at once
The module is suitable for various sizes of motherboards in all aspects
Package includes:
1 x Fixture