Ycs Dragon Arc Pad Chip Soldering

The term "Ycs Dragon Arc Pad" refers to a specialized BGA (Ball Grid Array) reballing soldering mat used for repairing small chips in mobile phones and other electronics, not a part for an arcade pad. It is manufactured by Ycs Yang, a tool company for electronics repair. 

BGA chip soldering is an advanced and delicate procedure requiring professional tools and skills. The process involves re-applying new solder balls to a chip's underside, where the connection pads are located. If you need to perform this type of soldering, follow these steps: 

Tools and materials

• Ycs Dragon Arc Pad

  : A heat-resistant magnetic silicone mat that provides a stable, non-slip surface and has cutouts for positioning BGA chips and stencils.

• BGA Stencil: A steel mesh that matches the pattern of the chip's solder pads.

• Solder Paste: A viscous mixture of solder and flux. Using a low-temperature paste (e.g., 183℃) is safer for beginners.

• Heat Source: A hot air gun or rework station is essential for melting the solder paste.

• Flux: Helps remove oxidation and promotes good solder flow.

• Soldering Iron: Used for cleaning pads and other general soldering tasks.

• Solder Wick/Braid: Used to absorb excess solder.

• Tweezers: Fine-tipped tweezers are necessary for handling small components.

• Cleaning Solution: Isopropyl alcohol is used to clean the chip and pads. 

Step-by-step soldering process

Preparation

1. Secure the mat: Place your

   Ycs Dragon Arc Pad

   on a stable, heat-resistant surface.

2. Clean the area: Before you begin, use isopropyl alcohol to thoroughly clean the pads on the circuit board where the chip will be attached.

3. Prepare the chip: If you are reusing a chip, you must perform a reballing process to apply new solder balls.

   • Place the chip in the correct slot on the Ycs pad.

   • Secure the appropriate BGA stencil to the chip using the pad's magnetic features.

   • Apply a thin, even layer of solder paste over the stencil holes.

   • Use a hot air gun to melt the solder paste, allowing it to form new, perfect balls on the chip's pads. 

Soldering the chip

1. Apply flux: Place a small amount of flux on the cleaned pads of the circuit board.

2. Position the chip: Carefully place the chip onto the corresponding pads on the circuit board, using tweezers for precise alignment.

3. Apply heat: Using a hot air gun, apply heat to the chip and pads in a circular motion to melt the solder underneath.

   • Avoid concentrating the heat in one spot to prevent damage. The heat-dissipating design of the Ycs pad helps prevent warping.

   • The chip will settle into place as the solder melts. You may see a slight "snap" or feel a settling when it is properly soldered.

4. Confirm the connection: After the chip has cooled, gently nudge it with tweezers to ensure it is firmly attached. Clean any excess flux with isopropyl alcohol. 

Disclaimer: The

Ycs Dragon Arc Pad

is for advanced micro-soldering and BGA reballing. If you are inexperienced, you risk damaging your electronic components. It is recommended to practice on old electronics or seek professional assistance.