YCS 2S CPU Heating Platform Magical Degumming Station
₱1000.00
Out of stock
The YCS 2S CPU Heating Platform Magical Degumming Station is a professional tool used for mobile phone repair. The "magical degumming" refers to its ability to quickly and safely remove adhesive from chips by heating them, eliminating the need for more damaging methods.
Features and uses
Adhesive removal: The tool is designed to heat IC chips and CPUs to soften the epoxy resin (glue) that secures them to the motherboard. This allows for a clean and efficient separation of the components, which is necessary for intricate board-level repairs.
Precision temperature control: The platform offers precise and stable temperature control to prevent damage to sensitive electronic parts. This is a safer alternative to using a hot air gun, which can deliver uneven heat and potentially burn chips.
BGA reballing: After a chip is removed, the heating platform can be used for BGA (Ball Grid Array) reballing, the process of applying new solder balls to the chip's pads before reinstallation.
Versatile applications: The YCS 2S is used for various tasks beyond CPU work, including other IC chip soldering, repairs on hard drives, and removing solder from other components.
Portable and user-friendly: The tool is compact and designed for easy operation, making it suitable for both professional repair shops and mobile technicians.