Mijing High Purity Tin Paste

Mijing High Purity Tin Paste

Mijing high purity tin paste is

a line of lead-free and silver-infused solder pastes used for soldering and repair work on small electronics, such as mobile phone motherboards, IC chips, and BGAs. The products are known for their high purity and different temperature formulations to suit various repair tasks. 

Key features

• Melting points: The paste is available in different formulas with varying melting points, including 138°C, 158°C, 183°C, and 190/199°C.

  • Low melting point (e.g., 138°C): Ideal for sensitive components that are susceptible to damage from high heat.

  • Medium and high melting points: Suitable for other applications on electronic circuit boards.

• High purity: Crafted with high-purity tin, the paste ensures reliable soldering and strong, lasting connections.

• Minimal residue: The paste leaves very little residue after soldering, which reduces post-repair cleaning time and helps achieve a professional finish.

• Enhanced conductivity: Some formulations, like the 158°C and 217°C, include silver particles for enhanced conductivity.

• Consistent application: Its smooth and consistent flow makes it easy to work with for precision micro-soldering tasks. 

Common applications

• Mobile phone repair: Widely used for repairing components on mobile phone motherboards, including BGA chip reballing.

• SMD soldering: Suitable for various surface-mount device (SMD) soldering applications.

• Reballing: Used for BGA reballing of chips on phones and other devices.

• Other electronics: Can also be used by hobbyists and professionals for other electronic soldering projects.