Mechanic XZ10 soldering ball

Mechanic XZ10 soldering ball

Mechanic XZ10 soldering balls are

tiny metal spheres used in micro-soldering and reballing for Ball Grid Array (BGA) components. These solder balls are applied to integrated circuit (IC) chips to form new connections, a common task in professional electronics repair for items like mobile phone motherboards. 

Key features

• Models: The XZ10 series includes both traditional leaded (Sn63/Pb37) and modern lead-free (Sn96.5/Ag3.0/Cu0.5) formulations.

• Application: They are primarily used in the reballing process for BGA, Chip Scale Package (CSP), and other high-density, surface-mount components. This is typically done with a stencil and a hot air station.

• Precision: The balls are produced with very high purity and sphericity to ensure uniformity and high-precision results for micro-welding.

• Properties: Both leaded and lead-free versions offer excellent mechanical properties, high reliability, and resistance to oxidation and thermal fatigue.

• Size: A variety of diameters are available, typically ranging from 0.2mm to 0.76mm. 

Common use cases

• Repairing mobile phones: Technicians use these solder balls for repairing ICs on smartphone motherboards.

• BGA reballing: The XZ10 series is a standard product for reballing BGA chips on various electronic devices.

• Reworking components: They are used for replacing or repairing the connections on microelectronic components in micro-soldering workshops.