Mijing Z21Max Cpu reballing stencil with magnetic base updated
₱2500.00
Out of stock
The "Z21 Max" is a universal reballing stencil platform for repairing IC chips on mobile phones, not a consumer electronic device like a smartphone or a tablet. Manufactured by Mijing, it is a tool used by phone repair technicians and DIY enthusiasts.
Product purpose
CPU reballing: It is used for planting tin on Ball Grid Array (BGA) CPU chips for both Android and iPhone devices, effectively allowing a technician to re-solder the processor.
Wide compatibility: The
Z21 Max
supports a broad range of devices, including iPhones (from the A8 up to the A18 CPU generation) and numerous Android phones with Qualcomm, HiSilicon, and other processors.
Precision and efficiency: The tool is designed to accurately align the stencil and the chip, ensuring a successful reballing process.
Key features
High-quality materials: The platform is constructed from durable, imported alloy steel that is resistant to high temperatures, abrasion, and metal fatigue, allowing for long-term use.
Magnetic positioning: A double-magnet system provides a strong, super-magnetic force to hold the chip and stencil securely in place, preventing any shaking or misalignment during the repair.
Precision alignment: Each mesh in the stencil is calibrated to match factory specifications, ensuring every solder joint is accurately positioned for consistent results.
Ease of use: The platform is dirt-resistant and easy to clean. Its rigid but flexible design allows the steel to bend and return to its original shape.
Options: The tool is sold in different versions, with kits tailored for iPhone CPUs, Android CPUs, or a combination of both.