Mijing Z20 Max Middle layer plates for Iphone X-16 set

The Mijing Z20 Max is a BGA reballing stencil platform for repairing the middle layer of iPhone motherboards, covering models from the iPhone X up to the latest iPhone 16 series. It is not a set of plates for a single iPhone 16 but a comprehensive kit with different plates or stencils to service many different models. 

What the Mijing Z20 Max kit includes

• Base platform: A magnetic base to securely hold the motherboard and stencils during the reballing process.

• Stencils: A wide variety of BGA stencils (thin metal plates with precisely cut holes) corresponding to different iPhone models, from the iPhone X to the 16 Pro Max.

• Gaskets and spacers: Components used to properly align and position the motherboards and stencils for different iPhone models. 

Purpose and function

This kit is used by professional technicians to perform Ball Grid Array (BGA) reballing, which is required when repairing faults related to the connection between the two layers of the iPhone's logic board. The process involves:

1. Separating the motherboard's two layers.

2. Cleaning old solder from the contact points.

3. Applying new solder paste using the correct stencil for the specific iPhone model.

4. Heating the board to melt the paste, forming new solder balls.

5. Rejoining the two layers to complete the repair.