LUOWEI LW-SP2 Needle Type Soldering Paste
₱220.00
The LUOWEI LW-SP2 is a series of lead-free, needle-type solder pastes designed for precision electronics repair, such as on mobile phones and BGA (Ball Grid Array) chips. It comes in a syringe with a needle tip for precise application. The LW-SP2 is available in several temperature variants to suit different applications.
Key features
Lead-free formula: The solder paste is made with environmentally friendly, lead-free materials for a safer soldering process.
Needle applicator: The needle-type syringe allows for very precise and controlled application of the paste, which is essential for working on small components.
Multiple temperature options: The
LW-SP2
comes in five different melting point options to accommodate various components and rework requirements. These include:
138°C
158°C
183°C
199°C
217°C
High purity and fluidity: The paste is noted for its high purity, excellent fluidity, and easy wettability, which facilitates easier tinning and creates clean, full solder joints.
Non-corrosive: It is formulated to be non-corrosive, preventing damage to sensitive components like integrated circuits (ICs) and printed circuit boards (PCBs).
Primary applications
The LW-SP2 is primarily used for precision soldering tasks in the electronics repair field, including:
Mobile phone repair: Ideal for repairing small, delicate components within smartphones.
BGA rework: Used for reballing and repairing BGA chips, which require precise application of solder paste.
SMT (Surface-Mount Technology) welding: Suitable for surface-mount component soldering on PCBs.
General electronics maintenance: Used for various other high-precision soldering jobs on electronics.