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2uul BH11 Universal Moblie Phone Middle Layer Frame BGA Reballing Magnetic Platform

₱650.00

Out of stock

The 2uul BH11 is a universal BGA reballing platform for mobile phone repair. It uses strong magnetic adsorption to hold a phone's middle-layer frame or motherboard securely, ensuring stable and precise alignment during the process of planting tin (reballing). This helps technicians perform repairs more efficiently and accurately. 

Features

  • Strong magnetic adsorption: Built-in strong magnets provide stable placement, automatically positioning the stencil and pad for a tight fit and preventing bulging.

  • Universal compatibility: The platform is designed to work with a wide range of mobile phone motherboards and CPUs, making it a versatile tool for both Android and other mobile devices.

  • High-precision alignment: The magnetic grip ensures precise positioning of components, simplifying the tin-planting process and making the resulting solder balls full and uniform.

  • Durable materials: It is crafted from high-quality, high-temperature-resistant materials, often incorporating a synthetic stone or silicon mat.

  • User-friendly design: Its straightforward design is suitable for both beginners and experienced professionals, enhancing workflow and reducing the risk of damage during delicate repairs.

  • Often includes accessories: Some listings indicate the inclusion of additional tools, such as scraping blades, to assist with the repair process. 

Purpose and benefits

The 2uul BH11 platform is used for the following applications in mobile phone repair:

  • Middle layer reballing: It provides a stable base for reballing the middle-layer frames of stacked logic boards, such as those found in iPhones.

  • IC chip reballing: Technicians can use the platform to reball various IC chips, including CPUs and memory chips, ensuring a strong connection to the motherboard.

  • Tin planting: The tool's precision makes it ideal for applying solder paste and tin planting, ensuring accurate placement for effective soldering.

  • Enhanced efficiency: By securely holding components, the platform frees the user's hands and streamlines the repair process, speeding up workflow.